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PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
Pinned Receiver
Surface-Mount Receiver
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
0.060
0.060
0.100
0.0 9 0
0.065
0.750
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
0.030 Dia. Finished
Figure 18: Recommended PCB Layout
PRODUCTION GUIDELINES
0.100
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
Soldering Iron
module are the primary mounting
surface. Since these pads are
Tip
inaccessible during mounting,
300
250
200
150
100
255°C
235°C
217°C
185°C
180°C
125°C
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
Solder
50
module’s underside. This allows for
very quick hand soldering for
PCB Pads
Castellations
0
30
60
90
120
150
180
210
240
270
300
330
360
prototyping and small volume
Time ( S econd s )
production.
Figure 19: Soldering Technique
Figure 20: Maximum Reflow Profile
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +220°C Max. (See adjoining diagram)
Page 16
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
Page 17
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相关PDF资料
MDEV-900-HP3-SPS-USB
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